About Advanced Packaging and Testing Taiwan

Focusing on Key Advanced Packaging and Testing Technologies to Build a Next-Generation Semiconductor Supply Chain Platform

Advanced Packaging and Testing Taiwan focuses on the semiconductor advanced packaging and testing supply chain. The exhibition brings together key technologies and solutions—including packaging and assembly equipment, testing and precision inspection, advanced materials, critical modules and components, smart manufacturing, and semiconductor cybersecurity—creating a premier platform for technology showcases and industry collaboration.

Exhibit Profile

1. Panel-Level Packaging（PLP/ CoWoS/CoPoS/CoWoP）
2. TGV/Glass Substrate
3. Semiconductor Package Equipment
4. Semiconductor Smart Auto Solution
5. Advanced Packaging and Testing
6. Advanced Packaging Materials
7. Electronic Equipment Key Module & Parts
8. Semiconductor Cybersecurity

Show Dates

April 21 (Wed.) - April 23 (Fri.), 2027
10:00 AM - 5:00 PM (Closing one hour early on the last day)
* Visitors under 18 are not admitted.

Venue
Taipei Nangang Exhibition Center,Hall1,4F
Address : No1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan  Map

Organizer

• Taiwan Display Union Association (TDUA)
• Chan Chao Int'l Co., Ltd.

Co-organizer

• Taiwan Panel & Solution Association (TPSA)
• Taiwan Semiconductor & Optronics Materials Devices Association (TSOMDA)
• Taiwan Electronic Equipment Industry Association (TEEIA)
• Society for Information Display (SID)

Contact Us

Taiwan Electronic Equipment Industry Association(TEEIA)
Ms. Cheng ext.35／Ms. Lin ext. 12 / Ms. Hsiao ext. 24
Tel: 886-2-2729-3933
Fax: 886-2-2729-3950
Email: show@teeia.org.tw

Chan Chao International Co., Ltd.
Mr. Jesse ext. 135 / Mr. Nathan ext. 145
Tel: 886-2-2659-6000
Fax: 886-2-2659-7000
Email: touch@chanchao.com.tw