Intelligent Optical Wafer Surface Defect and Height Variation Inspection Equipment

Model: SE-5AT2

Booth No: L701

Characteristic

Provide accurate optical inspection and analysis for the defects generated in the semiconductor wafer manufacturing process.
Apply the microscope auto focus module and the XYZ axis displacement platform (integrated optical scale) to perform flying trigger to capture the wafer surface image.
The image comparison method and AI image deep learning method can be provided according to the defects that need to be detected, which can reduce the occurrence of overkill and underkill, automatically sort OK and NG parts with customized tolerances, calculate defect area, number of defects, and mark the defect location.
It can also be integrated with automation to improve detection efficiency.

https://www.buenooptics.com/5at2.html

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Intelligent Optical Wafer Surface Defect and Height Variation Inspection Equipment

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