PVTC Analyzer
Model: PVTC-A1
Category: Industrial Supply
Exhibitor: U-CAN DYNATEX INC.
Booth No: Q214
Characteristic
During IC packaging process, the curing reaction of the packaging material causes considerable shrinkage and warpage of the chip package body, which is one of the main reasons why the quality of the package body would be difficult to control.
U-can Dynatax Inc's pressure-volume-temperature-cure measuring instrument (PVTC) is developed specialized in measuring the slight changes of specific volume in material during curing reaction under different temperature, pressure and other conditions, and precisely predict the warping behavior of the material after packaging, which are used to improve the product yield rate.
In addition, U-can Dynatax Inc 's various high-precision crosslinking reaction analyzers are also dedicated to measure the curing reaction of materials which are used for wearable electronic products, mobile electronic products and 5G products. Please contact U-can Dynatax Inc.
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