Customized Industrial Laser-Processing Facility
Category: Laser Processing Application
Exhibitor: SUPERBIN COMPANY, LTD.
Booth No: k416
1. Thin-film panel cutting.
2. PI substrate lift-off from glass (Laser Lift-Off, LLO).
3. Glass cutting (breaking) without damages of bottom film and/or metal circuit.
4. Film half-cutting without damages of bottom film and/or metal circuit.
5. Periodic microstructure
6. Direct laser engraving of flexographic plates and cylinders
7. Sub-surface laser engraving (SSLE)
8. Direct photopolymer laser imaging
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