Semiconductor processing application technology

Exhibitor: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Booth No: P1210

Characteristic

In Taiwan, a significant market for electronic devices (such as semiconductors, packaging, panels, and circuit boards), the demand for manufacturing methods is shifting from traditional labor-dependent and experience-based production to digitalized and intelligent production models in response to the era of smart manufacturing. In the field of precision machining, the semiconductor industry has been trending towards advanced packaging technologies like 3DIC and SiC compound semiconductors, which have led to the development of laser processing techniques. Consequently, there is a growing demand for processing techniques applicable to these substrates, with picosecond and femtosecond ultrafast laser sources becoming the primary choice in this industry. By integrating laser-sensitive and intelligent sensors with precise beam control modules, ultrafast laser sources are providing the semiconductor industry with high-speed development solutions.
Laser technology, with its high precision processing capabilities, plays an indispensable and thriving role in the field of advanced manufacturing. Laser processing applications span a wide range of industrial manufacturing processes, including engraving, cutting, welding, and surface treatment, all of which have seen advancements and upgrades in traditional industries due to the implementation of laser processes. Although the laser source market itself may be relatively small, it serves as a core driving force for the development of the manufacturing industry, capable of transforming the overall manufacturing landscape and propelling industries into a new era of high-tech advancements. The importance of laser technology in this context is self-evident.