World Premiere: GF Machining Solutions unveils revolutionary LASER S 500 (U) at EPHJ 2024

From 11 to 14 June 2024, visitors to the EPHJ in Geneva experienced the LASER S 500 (U). This advanced machine from GF Machining Solutions redefines micromachining and 3D surface processing with its unparalleled accuracy, speed, and flexibility, capturing significant interest among industry experts.

Philippe Langel, Head of Laser Technical Unit and Anne-Sophie Massart, Laser Sales Specialist, unveiled the LASER S 500 (U) to a large group of visitors. In a live demonstration, the distinctive features and impressive machine performance were presented to the audience. In his speech, Philippe Langel explained why Laser technology is the logical next step in the development of micro-production: « In our world, there is a clear demand for miniaturization, aesthetic surfaces, and processing of extremely hard materials. Inspired by our customers and integrating the most advanced technologies, the LASER S 500 (U) is our ultimate solution for micromachining and 3D surface processing. I am convinced that this machine will redefine the way to micro-shape parts, tools, molds and dies in a near future.”

Conceived to drive users’ application success

Across a wide range of industry segments, from electronic components to ICT (information and communications technology) as well as medical technology and watchmaking, the LASER S 500 (U) offers precision parts manufacturers a chance to break free from conventional machining techniques and experience the many benefits of the Laser technology, including its performance and energy efficiency. Anne-Sophie Massart, Laser Sales Specialist, talks proudly about the machine: " This machine brings Laser Micromachining to the next level with impressive dynamic and precision “, and adds with confidence “I would like to see anyone else achieve that. This machine is the proof that GF Machining Solutions is a world leader.”

For electronic components and ICT, this solution masters everything on hard and brittle material such as silicon carbide (SiC), silicon nitride, alumina, and tungsten carbide. Mold and die applications such as die-bonding tools for IC packaging, as well as part production applications like micro-electronic tooling, wedge bonding, or SiC wafer chucks, can benefit from the machine’s micro-engraving, micro-shaping, surface texturing and structuring operations.

The LASER S 500 (U) can serve parts production for medical industry applications, such as texturing of orthopedic implants as well as medical instruments with a high added value. It also enhances precision parts production in watchmaking, giving users a fast, accurate process for decoration, marking, coloration and micro-engraving.

With its remarkable speed and accuracy across an array of materials and applications, GF Machining Solutions and the LASER S 500 (U) are setting the course for the future of micromachining and 3D surface processing operations.

Highly configurable

The LASER S 500 (U) is available in various configurations: with three or five axes and with different laser sources in nanosecond or femtosecond laser. Conceived to meet customers’ specific needs, this solution also boasts a new and improved human-machine interface (HMI), ensuring a user-friendly machining experience and providing advanced machine control to successfully tackle the most complex applications.

Thermoregulation boosts accuracy, repeatability

Additionally, the LASER S 500 (U) is fully thermoregulated: Key machine components are water-cooled to guarantee the accuracy and repeatability of the machining cycle. As a result, users maintain consistent quality across long machining cycles, resulting in high precision and quality across the complete machining time. 

High dynamics drive speed, productivity

Moreover, this solution’s high dynamics drive its speed and productivity: Powerful components and a high-speed 3D scanner in combination with linear and torque motors mean manufacturers can machine with full speed, regardless of workpiece complexity. Micromachining and 3D surface processing become easy with the LASER S 500 (U).

Unrivaled accuracy regardless of material

Like all solutions in the LASER S series, the new LASER S 500 (U) offers unrivaled accuracy, allowing manufacturers to achieve shape accuracy down to ±5 μm and surface finishes as fine as Ra 0.1 μm on the softest materials like gold to the hardest such as SiC. It can be said that these features are genuinely unparalleled. Philippe Langel underlines: "The Laser S 500 (U) condenses 15 years of innovations for our customers. The level of performance of this machine and its flexibility are unique on the market. I am extremely grateful to everyone who participated in this project for having made this dream possible.”