Pulse Dissolving Copper Electroplating
產品分類:原物料和化學品
廠商名稱:GUANGDONG GUANGHUA SCI-TECH CO., LTD.
攤位號碼:709
產品特色
1. Hole filling time is fast, plating can be completed in 50 min with 100 μm aperture and 80 μm interlayer thickness;
2. The thickness of the hole filling layer is thin, surface copper thickness of 100 μm aperture blind hole plating is below 15 μm, and 75 μm aperture blind hole plating is below 10 μm;
3. Can fullfill 75~150 μm hole filling requirements.
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