Copper
Model: SLOTOCOUP PRT 2200
Category: Raw Materials and Chemicals
Exhibitor: SCHLOETTER ASIA
Booth No: 613
Characteristic
Reverse Pulse Plating in pattern plating mode, combined with a extreme Via filling process capable to fill Blind vias with minimum copper in the surface (below 3 μm) opens a new horizon for SAP production, combining the benefits of Via filling processes together with Reverse Pulse plating in terms of track shape and surface distribution.
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