Copper
Model: SLOTOCOUP XF 60
Category: Raw Materials and Chemicals
Exhibitor: SCHLOETTER ASIA
Booth No: 613
Characteristic
Latest development in Via filling processes. Target to fill blind vias in Flash mode with minimum copper thickness on panel mode. When combined with our SLOTOGO PCB 3700 it is possible to fill Blind Mircovias with < 3 μm inn the surface enabling SAP applications with fine L/S below 10 μm.
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