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Copper

Model: SLOTOCOUP SF 50

Category: Raw Materials and Chemicals

Exhibitor: SCHLOETTER ASIA

Booth No: 613

Characteristic

Universal 3-in-1 process, capable for Via Filling, TH Filling of Core layer and TH conformal plating in inner and outer layer up to AR 5. Its reliability, uniformity, combined with high productivity due to the capability using current density above 2 A/dm2 made it the record running and most successful process in main IC-substrate and SLP/Any layer makers in Asia.

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