DUPONT TAIWAN LIMITED

 

Booth No: 309

Website: https://www.dupont.com/

 

Exhibitor Profile

 

High-performing materials and advanced chemistry to flex, rigid-flex, rigid PCB, and IC substrate configurations for higher performance and efficiency.
Advanced circuit metallization and imaging materials for fine line trend
• A new generation pulse electroplating for advanced MLB
• High reliability solution for multi-stack micro-via HDI application
• A new generation via filling technology for fine line HDI application
• Advanced dry film photoresist for fine line HDI
Low-loss and signal integrity solutions for higher frequency and higher speed signal-transmission applications
• An ideal Flexible Printed Circuit (FPC) laminate solution for high-reliability applications.
• A thin buried capacitance laminate designed to function as a power and ground plane in high-speed signal transmission PCB.
• A thermally conductive insulted metal PCB substrate system used for heat dissipation in electronics circuit boards.

 

 

 

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